JPH0485741U - - Google Patents
Info
- Publication number
- JPH0485741U JPH0485741U JP12647290U JP12647290U JPH0485741U JP H0485741 U JPH0485741 U JP H0485741U JP 12647290 U JP12647290 U JP 12647290U JP 12647290 U JP12647290 U JP 12647290U JP H0485741 U JPH0485741 U JP H0485741U
- Authority
- JP
- Japan
- Prior art keywords
- engaging
- solder coating
- lead frame
- pressing
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 210000000078 claw Anatomy 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12647290U JP2527420Y2 (ja) | 1990-11-30 | 1990-11-30 | 電子部品のはんだ被覆装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12647290U JP2527420Y2 (ja) | 1990-11-30 | 1990-11-30 | 電子部品のはんだ被覆装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485741U true JPH0485741U (en]) | 1992-07-24 |
| JP2527420Y2 JP2527420Y2 (ja) | 1997-02-26 |
Family
ID=31874028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12647290U Expired - Fee Related JP2527420Y2 (ja) | 1990-11-30 | 1990-11-30 | 電子部品のはんだ被覆装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527420Y2 (en]) |
-
1990
- 1990-11-30 JP JP12647290U patent/JP2527420Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527420Y2 (ja) | 1997-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |